Characteristics Data of NSN 5910-01-096-8707, 5910010968707
| MRC | Criteria | Characteristic |
|---|---|---|
| AAQL | BODY STYLE | CHIP TYPE |
| AARG | RELIABILITY INDICATOR | NOT ESTABLISHED |
| ABJT | TERMINAL LENGTH | 0.020 INCHES NOMINAL |
| ADAQ | BODY LENGTH | 0.800 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.125 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.025 INCHES MINIMUM AND 0.055 INCHES MAXIMUM |
| AEBP | CENTER TO CENTER DISTANCE BETWEEN TERMINALS PARALLEL TO LENGTH | 0.040 INCHES NOMINAL |
| AEBZ | SCHEMATIC DIAGRAM DESIGNATOR | NO COMMON OR GROUNDED ELECTRODE(S) |
| CQBF | INSULATION RESISTANCE AT MAXIMUM OPERATING TEMP | 10000.0 MEGOHMS |
| CQBQ | CAPACITANCE VALUE PER SECTION | 0.100 MICROFARADS SINGLE SECTION |
| CQFB | VOLTAGE TEMP LIMITS PER SECTION IN PERCENT CAPACITANCE CHANGE | -15.0/+15.0 WITHOUT VOLTAGE APPLIED SINGLE SECTION |
| CQJJ | NONDERATED OPERATING TEMP | -55.0 DEG CELSIUS MINIMUM AND 125.0 DEG CELSIUS MAXIMUM |
| CQWM | NONDERATED CONTINUOUS VOLTAGE RATING AND TYPE PER SECTION | 50.0 DC SINGLE SECTION |
| CRTP | TOLERANCE RANGE PER SECTION | -10.00/+10.00 PERCENT SINGLE SECTION |
| CWJK | CASE MATERIAL | CERAMIC OR GLASS |
| CWPK | INSULATION RESISTANCE AT REFERENCE TEMP | 100000.0 MEGOHMS |
| CWPM | DISSIPATION FACTOR AT REFERENCE TEMP IN PERCENT | 2.5000 |
| CWSG | TERMINAL SURFACE TREATMENT | GOLD |
| PMLC | PRECIOUS MATERIAL AND LOCATION | TERMINAL SURFACES GOLD |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
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