| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-333-1445 Item Description: Transistor | 5961 | 013331445 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| Rf2266 | 2 | 2 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | METAL |
| ABJT | TERMINAL LENGTH | 0.293 INCHES MINIMUM AND 0.303 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.150 INCHES MINIMUM AND 0.164 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 0.247 INCHES MINIMUM AND 0.257 INCHES MAXIMUM |
| AKPV | MOUNTING FACILITY QUANTITY | 2 |
| ALAS | INTERNAL CONFIGURATION | FIELD EFFECT |
| CTRD | POWER RATING PER CHARACTERISTIC | 14.4 WATTS MAXIMUM TOTAL DEVICE DISSIPATION |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD AND 1 TAB, SOLDER LUG |
| ABHP | OVERALL LENGTH | 0.815 INCHES MINIMUM AND 0.825 INCHES MAXIMUM |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 1.40 AMPERES MAXIMUM DRAIN CURRENT |
| AXGY | MOUNTING METHOD | TERMINAL AND UNTHREADED HOLE |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | III SEMICONDUCTOR MATERIAL | SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 65.0 MAXIMUM DRAIN TO SOURCE VOLTAGE AND 20.0 MAXIMUM GATE TO SOURCE VOLTAGE |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 200.0 DEG CELSIUS JUNCTION |
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